In today's rapidly developing semiconductor industry, small chips carry countless technological dreams. But do you know that the performance of semiconductor devices in different temperature environments directly affects the stability and reliability of electronic products? At this year's Semiconductor Equipment Conference held at Wuxi Taihu International Expo Center, we at Beier also felt the development of the electronics industry. And the two test standards GB/T 2423.1 and GB/T 2423.2-2008 are like 'temperature examiners' for semiconductor devices, strictly controlling their 'quality checkpoint' under high and low temperature environments.

Interpretation of GB/T 2423.1 and GB/T 2423.2 Standards

GB/T 2423.1 Low-Temperature Test Endurance

It is mainly applicable for testing the ability of electrical and electronic products to be used, transported, or stored in low-temperature environments. 

The standard specifies different test methods, such as low-temperature tests for non-heat-dissipating test samples (including temperature shock and 

temperature gradient) and low-temperature tests for heat-dissipating test samples. The lowest temperature severity level can reach -65°C, with test 

durations ranging from 2 hours to 96 hours. During the test, the allowable temperature deviation range inside the test chamber is ±3°C, and the 

temperature change rate should not exceed 1K/min (the average value over no more than 5 minutes).

GB/T 2423.2 High Temperature Environment Challenge

Focuses on performance testing of electrical and electronic products in high-temperature environments, covering high-temperature tests for both 

non-heat-dissipating and heat-dissipating test samples. The test temperature range can be from +70°C to +155°C, and there is also a requirement

 that the temperature change rate does not exceed 1K/min (average over no more than 5 minutes). By placing the product in a set high-temperature

 environment for a specified period of time, its ability to withstand high temperatures is examined.

Beier High and Low Temperature Test Chamber

From structural design to performance parameters, it demonstrates a deep alignment with and surpassing of the GB/T 2423.1 and GB/T 2423.2-2008 standards. Structure and Control: It adopts an integral structure, with the inner wall formed by special process roll pressing, and the overall TG welded seamlessly. The door lock mechanism uses a lever power opening, ensuring safety and reliability. The control modes include constant operation mode and program operation mode, offering convenient and flexible operation.

Temperature Parameter: The temperature range can reach as low as -70°C and as high as +150°C, far exceeding the basic requirements of the GB/T 2423.1 and GB/T 2423.2-2008 standards. The temperature fluctuation is ≤1.0°C (as per GB/T 5170.2-1996, which indicates a fluctuation of ±0.5°C under no-load and constant conditions), and the temperature deviation is ≤2.0°C (under no-load and constant conditions). Its accuracy is better than the specified standard, providing semiconductor devices with a more stable and precise high-low temperature testing environment.

Temperature Change Rate: The temperature change rate ranges from 0.7°C - 1.2°C / 1°C - 5°C (at 10°C, 15°C, 20°C, 25°C) per minute (overall average or linear average), which can meet the diverse testing requirements of different semiconductor devices for temperature change rate.

Empowering the Semiconductor Industry: Bell's Solutions

The development of the semiconductor industry is inseparable from the pursuit of 'temperature reliability' to the extreme. The diverse equipment at Bell Labs, anchored by GB/T standards, accurately meets the full-range testing needs from small chips to large-scale devices. This truly achieves 'temperature reliability' for the entire process of the semiconductor industry, from R&D to mass production.